|
Much lower manufacturing costs and higher long-term reliability are the challenges that MEMS manufacturers need to face and solve in order to dramatically enhance their market penetration.
The shift from hermetically sealed metallic and ceramic packages to wafer-to-wafer bonded MEMS and the use of appropriate getter solutions, able to maintain the suitable environmental conditions inside the MEMS packages for the entire device lifetime, are the technological solutions that will enable MEMS industry to reach both the above targets.
 |
SAES Getters supports these technological efforts by offering dedicated getter solutions suitable for all types of vacuum packaged MEMS devices, both at package level and at wafer level: SAES' Page film product line, consisting of getter thin films, few-micron thick, can be deposited and patterned on different substrates in a variety of shapes. SAES thin film getter solutions maintain the suitable operational conditions of the device, either vacuum or inert gas, by keeping pressure or impurity level respectively under control, thus increasing reliability and lifetime of the final device.
Tailor-made getter film composition and deposition patterns can be developed thanks to the Group's proven capability of teaming up with customers to define product requirements and implement fully customized solutions. |
The new Page film product line encompasses:
-
-
PageLid, for discrete hermetic ceramic or metallic MEMS packages
-
Rel-Hy, for GaAs-based packages and hydrogen-sensitive packages
Through the engineering of the Page film product line, the SAES Getters Group currently contributes to the European Community's VABOND Research Project, aimed at the development of improved wafer-to-wafer bonding techniques allowing long term stability of vacuum encapsulated MEMS devices.
Learn more about the competitive advantages that our new Page films can deliver by downloading the full product brochure.
|