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ZeDry®/M Lid consists of a metal lid, coated with a solventless, thermally cured getter layer engineered for high capacity moisture uptake. Lid material, shape, dimensions and finishing are specified by customers.
ZeDry/M Lid is designed for optoelectronic and microelectronic device packaging, both hermetic and semi-hermetic architectures. The ZeDry/M getter coating deposited on the lid works as a reversible getter for moisture: it can be fully activated with a thermal process at 100°C-120°C, just before the device sealing.
The ZeDry/M Lids can be provided in a variety of metals (e.g. Al, Ni, Au, Stainless Steel, KOVAR) and engineered metal alloys (e.g. Ni/Au-plated KOVAR). Ceramic and glass can also be considered as options, for special applications.
  • Lid design and materials according to customers’ specs
  • High moisture sorption capacity
  • Reversible getter for moisture
  • Moisture sorption is thermally activated
  • Solvent free getter, epoxy based
  • Extremely low outgassing
  • Compatible with seam welding or laser welding processes
  • No loose particles
  • Microelectronic devices
  • Optoelectronic devices
  • Optical modules
  • Hermetic or semi-hermetic packages