Modules HV

The HV Wafer Module is a compact, flangeless NEG pump solution designed to deliver high performance in high vacuum systems. Engineered to handle distributed pumping speed and capacity for hydrogen (H₂) and other active gases such as water vapor (H₂O), oxygen (O₂), nitrogen (N₂), carbon monoxide (CO), and carbon dioxide (CO₂), it is ideal for environments that demand clean, oil-free vacuum performance at pressures from 10⁻⁹ to 10⁻⁷ Torr.

Each module integrates NEG disks manufactured with the advanced ZAO® alloy (Zr-V-Ti-Al), specifically optimized for the high vacuum regime. Thanks to the flexibility and efficiency of the ZAO NEG technology, the HV Wafer Module enables distributed pumping inside the vacuum chamber, maximizing surface area utilization and ensuring low outgassing and minimal footprint.

Multiple HV Wafer Modules can be operated simultaneously via series or parallel electrical connections, offering modularity and scalability. The SAES team provides technical support and configuration guidance to ensure optimal installation and electrical performance of interconnected modules in research labs, particle accelerators, or vacuum coating systems.

• High pumping speed for all active gases, including H₂, H₂O, O₂, N₂, CO, and CO₂
• Large sorption capacity with extended operational lifetime
• Consistent NEG pumping performance across High Vacuum (HV), Ultra-High Vacuum (UHV) and eXtreme High Vacuum (XHV) conditions
• Reversible hydrogen pumping capability, including hydrogen isotopes
• Stable operation in strong magnetic fields, ideal for integration in accelerator and microscopy environments
• Completely oil-free and vibration-free solution for ultra-clean vacuum systems
• Lightweight and modular, with easy installation in compact vacuum chambers
• Rapid pumpdown even after venting to atmosphere, no bake-out required
• Leak-tolerant NEG design, suitable for systems with moderate air ingress
• Fully compatible with Viton®-sealed vacuum systems

• Enhancing ultimate vacuum performance when combined with ion pumps, cryogenic pumps, diffusion pumps, or turbomolecular pumps
• Integration into surface analysis systems, such as XPS, AES, and SIMS
• Vacuum environments of synchrotron radiation facilities, particle accelerators, and beamlines
• Use in deposition chambers and process pumps for semiconductor and coating technologies
• Thin film deposition equipment for research and industrial applications
• Portable vacuum instrumentation and mobile analytical tools
• Hydrogen isotope management: pumping, storage, and controlled release
• Removal of residual impurities in noble gas–filled vacuum devices

Learn more about our full range of NEG solutions on our Solutions page.